Rigid, flexible, rigid-flex, HDI, high-frequency and multilayer boards, plus turnkey PCB assembly.
Single-sided, double-sided and multilayer FR-4 boards from 1 to 36 layers, for industrial control, power supplies, instrumentation and consumer electronics.
Polyimide flex circuits and rigid-flex constructions. They remove cables and connectors, cut assembly steps, and keep working through repeated bending.
Multilayer rigid sections joined by a flexible polyimide bend area — no connectors, no cables, fewer solder joints.
High-density interconnect boards with laser-drilled microvias and sequential lamination, for designs where component density and layer count both have to go up.
Laser-drilled microvias and buried vias allow denser routing without adding layers — up to five sequential build-up stages.
Low-loss laminates and controlled-impedance stack-ups for RF, microwave and high-speed digital designs, where signal integrity has to hold up in production and not just in simulation.
High layer counts with tight layer-to-layer registration and controlled impedance, including large-format panels for backplane and rack applications.
Turnkey SMT and through-hole assembly with component sourcing and hard-to-find part procurement, so you receive a finished board rather than a bare one.
We check your data and stack-up before production and flag anything that would raise cost or hurt yield.
Standard and hard-to-find components sourced as part of an assembly order, with manufacturer names declared.
12 hours for a 2-layer board and 24 hours for 4 layers, so a design change does not cost you a week of schedule.
Send your Gerber files or a simple specification and we will come back with a quote within 12 hours.