Layer counts from 1 to 36, board thickness 0.1–8.0 mm, HDI up to 5 stages, minimum 75 µm trace, panels up to 21 × 33 inch.
If your design falls outside these ranges, ask us anyway — we will tell you honestly whether we can build it.
| Item | Capability |
|---|---|
| Layer count | 1 – 36 layers |
| Board thickness | 0.1 – 8.0 mm |
| Minimum trace / space / annular ring | 75 µm (approx. 3 mil) |
| Minimum mechanical drill | 0.2 mm standard · 0.15 mm on request |
| Outer layer copper | 35 µm and 70 µm standard · up to 400 µm on request |
| Maximum finished copper thickness | 12 oz |
| Maximum panel size | 21 × 33 inch |
| Minimum board size | 5 × 5 mm · below 3 mm assessed case by case |
| HDI build-up stages | 1 – 5 stages · 6 stages and above assessed case by case |
| Base material | FR-4 · high-Tg FR-4 (Tg 150 / 170) · polyimide |
| High-frequency material | PTFE · ceramic-filled · Rogers (for example RO4350B) |
| Surface finish | Lead-free HASL · ENIG (immersion gold) · ENEPIG (bonding gold) · immersion silver and immersion tin on request |
| Solder mask colour | Green standard · black, blue, white and red on request |
| Impedance control | Controlled-impedance stack-ups available |
| Quality standard | IPC production standard · IPC-A-600 Class 2 / Class 3 |
| Certification | ISO 9001 · ISO 14001 · IATF 16949 · UL recognised · RoHS compliant |
| Testing | SGS test reports available |
| Order size | Prototype, small and medium volume — no high MOQ requirement |
Express times apply to straightforward designs with data ready to release. We confirm the actual date with your quote.
| Item | Capability |
|---|---|
| SMD package size | Down to 01005 — three fiducial marks required per assembly side |
| BGA | Down to 0.6 mm pitch |
| Fine pitch | Down to 0.4 mm |
| Through-hole | Any THT component type |
| Customer-supplied parts | Accepted — tell us what you are providing |
| Data required for assembly | PCB data (Gerber, ODB++, CAM, CAD) · pick-and-place file · BOM with manufacturer names · assembly drawing |
The maximum upload size for assembly data is 10 MB per file. For larger packages, send a file-transfer link and we will confirm receipt.
Send the Gerber and your design rules — we will tell you straight away whether we can build it, and what it costs.